Key features:
Double Layered Panel Door
Hot air escapes from door top while cold air move in from door bottom. air inside door become heat insulator. It reduces heat loss from the oven, saving energy and keeping the panel cool.
CBI series and WBI series
(Baking Plares Size:240mmX240mm;suitable for cones length 108mm or less and waffle basket)
|
CBI-47A*/CBI-47X2A* |
CBI-71A*/CBI-71X2A* |
CBI-107A*/CBI-107X2A* |
Number of baking plates |
47 |
71 |
107 |
Standard Cones/hour** |
4200 |
6600 |
9500 |
Gas Consumption(kg)/hour |
5-6 |
9-10 |
11-12 |
Machine Dimension(mm) |
6700L*2400W*1800H |
9600L*2400W*1800H |
13900L*2400W*1800H |
Machine Weight(kg) |
4500 |
6500 |
9600 |
Main Motor specification |
1.5hp;1.1kw |
2.0hp;1.5kw |
2.0hp;1.5kw |
CBIII series and WBIII series
(Baking Plares Size:320mmX240mm;suitable for cones length over 125mm and waffle basket)
|
CBIII-39A*/CBIII-39X2A* |
CBIII-55A*/CBIII-55X2A* |
CBIII-61A*/CBIII-61X2A* |
Number of baking plates |
39 |
55 |
61 |
Standard Cones/hour** |
3500 |
5500 |
6000 |
Gas Consumption(kg)/hour |
5-6 |
9-10 |
10-11 |
Machine Dimension(mm) |
7000L*2400W*1800H |
9500L*2400W*1800H |
10500L*2400W*1800H |
Machine Weight(kg) |
4700 |
6500 |
8500 |
Main Motor specification |
1.5hp;1.1kw |
2.0hp;1.5kw |
2.0hp;1.5kw |
CBIV series and WBIV series
(Baking Plares Size:260mm*240mm;suitable for cones length between 100mm to 120mm and waffle basket)
|
CBIV-45A*/CBIV-45X2A* |
CBIV-63A*/CBIV-63X2A* |
CBIV-97A*/CBIV-97X2A NEW* |
Number of baking plates |
45 |
63 |
97 |
Standard Cones/hour** |
4000 |
6000 |
9000 |
Gas Consumption(kg)/hour |
5-6 |
9-10 |
11-12 |
Machine Dimension(mm) |
6800L*2400W*1800H |
9000L*2400W*1800H |
To be confirmed |
Machine Weight(kg) |
4500 |
6500 |
10000 |
Main Motor specification |
1.5hp;1.1kw |
2.0hp;1.5kw |
2.0hp;1.5kw |
*Ameans one cone per baking plate while x2A means two cones per baking plate
** Standard cone is 23° with cone length 110mm; standard cone /hour for x2A(two cones per baking plate) only.
Also, production output depends on the quality of cone mix, oven tempreature and thickness of wafer.